The base material used in the copper foil of PCB

      You need to see the step-by-step approach for understanding the manufacturing pattern of the printed circuit board. Fabrications of these boards contain different layers. Let’s understand this with the sequence:

Substrate material:

      The base foundation over the plastic board enforced with glass is the substrate. A substrate is a dielectric structure of a sheet usually made up of epoxy resins and glass paper. A substrate is designed in such a way that it can meet the requirement for example transition temperature (TG).

Lamination:

      As clear from the name, lamination is also a way to get required properties like thermal expansion, shear strength, and transition heat (TG). Lamination is done under high pressure. Lamination and substrate together play a vital role in the flow of electrical charges in the PCB.

Silkscreen:

      Silkscreen the text part of the printed board circuit and applied it to the part of the board. It consists of logos, numbers, letters that are written for hobbyists and engineers to understand the functionality of printed board circuits.

Solder Mask:

      Solder masks identify the color of the printed board circuit. Usually, it is designed to be in green but now there are many other colors readily available in the market or you can also order a specific color from your manufacturer. The color of the printed board circuit would not affect its functionality.

Metal foiling:

      For the flow of electrical charges, traces and pathways are made in printed board circuits. These traces join the components of the board and help electric charges and signals flow. So metal plays a significant role in the functionality of the board. For this purpose, copper metal is used in traces because of its high conductivity also copper is inexpensive and easily available.

The thickness of copper foil

      The greater the thickness of the copper foil in the printed circuit board, the better is the flow of charges. However, etching of the board can be difficult by thick layers of copper foil. Generally, the copper foil thickness is expressed in an ounce. We will distinguish the thickness per unit area of the printed boards. That means one ounce of copper foil will cover one square foot area of the board. Usually, the copper foil thickness in single-sided and double-sided printed boards is 1.4 mil which is 35 µm. 18 µm, 35 µm, 55 µm, and 70µm are the most commonly used thickness of copper foil in printed circuit boards.

What is the Role of copper foiling in PCB?

      Printed board circuits are made up of many layers and components that include traces, silkscreen, metal layers, and other materials. Traces are the joining components of the PCBs because no charge flow can happen without traces, so we can say that traces act as blood vessels in the PCB’s Skelton, and without traces, no PCB would able to function. And without PCBs, there is no concept of electronic devices.  In the present age, every single device is making use of PCB. And the PCBs rely most on copper as compare to other components because copper helps in making traces. The reason for using copper is its conductivity. The conductivity of copper metal makes sure the slow of signals in the electronic device without interruption. The reason for copper’s high conductivity is the presence of only one electron in its valence shell. This one-electron can easily move from one atom to another without any resistance. That’s why copper can carry electric charges without losing signals.
      For making continuous metal foil, copper which is a negative electrolyte is used on the first layer of PCBs. Due to the low level of surface oxygen; copper can be easily used with various types of substrates, metals, and insulating layers. Copper is used with the protective layer to form different circuit patterns after etching because it can easily make bonds with insulating layers of PCB. Copper foil can provide better continuity of electromagnetic shielding that’s why is being placed on the substrate sheet surface.