Flex and Flex-Rigid Capacity

Home > Capabilities > Flex and Flex-Rigid Capacity

Item		Description	Remark
Rigid-flex PCB layer count		2-14L
Flex Layer Count		2-10L
Flex layer on outer or Middle Layer		Middle
Finished board thickness		0.2-4.0mm
Tolerance of board thickness		>1.0mm, ±10% ≤1.0mm, ±0.1mm
Min. flex layer width		2.5mm
Min. flex layer width between rigid layers		3mm 2mm (limit)
Max. panel size		406x736mm
Min. panel size		10x15mm
Impedance tolerance		Single-ended: ±3Ω (≤50Ω), ±8% (>50Ω) Differential pair: ±4Ω (≤50Ω), ±8% (>50Ω)
Min. Twist & Warp		0.75% (symmetrical); 1.5% (asymmetrical)
Adhesive dispense width		1.5±0.5mm (slot width≥5mm))
Min. distance between R-F connect area to conductors		0.3mm (Half depth slot process) 0.5mm normal
Min. width of resin flow out in R-F connect area		0.5mm 1.0mm normal
Min. distance between E-test pads		3mil 4mil normal
Min. inner layer line width/space before compensation	Finished copper thickness18um	3.5mil (partial3.2mil)/3mil (partial3mil)
	Finished copper thickness 35um	3.5mil (partial3.2mil)/3.5mil (partial3mil)
	Finished copper thickness 70um	5.5mil (partial5mil)/4.5mil (partial4.2mil)
Inner layer grid	Finished copper thickness 18um	5/5mil (after compensation)
	Finished copper thickness 35um	6.5/5mil (after compensation)
	Finished copper thickness 70um	10/8mil (after compensation)
Min. Inner layer annual ring width (IPCIII, before compensation)		4mil (≤6L), 8mil (7-11L), 12mil (≥12L)
Min. annual ring single side (laser hole, before compensation)		3mil (partial 2.5mil) 4mil (partial 3.5mil)
Min. inner layer isolation strip width		8 mil 10mil normal
Min. inner layer isolation annual ring width		5mil (≤6L), 6mil (7-11L), 10mil (≥12L)
Max. inner layer finished copper thickness		3oz
Min. distance between inner layer conductor and outline		8 mil 10mil
Min. external layer line width/space before compensation (Rigid on top/bottom)	Finished copper thickness, before compensation	4mil (partial3.0mil)/4mil (partial3.0mil)
	Finished copper thickness 35um, before compensation	4mil (partial3.2mil)/4mil (partial3.0mil)
	Finished copper thickness 70um, before compensation	6mil (parital5.0mil)/6mil (partial4.5mil)
Min. external layer line width/space before compensation (Flex on top/bottom)	Finished copper thickness, before compensation	6mil (partial4.5mil)/6mil (4.2mil)
	Finished copper thickness 35um, before compensation	6mil (partial5.0mil)/6mil (partial4.5mil)
	Finished copper thickness 70um, before compensation	8.0mil (partial6.5mil)/ 8.0mil (partial5.5mil)
Min. annual ring for PTH in external layer (class II)	Finished copper thickness, before compensation	4mil
	Finished copper thickness 35um, before compensation	5mil
	Finished copper thickness 70um, before compensation	8mil
Min. annual ring for PTH in external layer (class III)	Finished copper thickness, before compensation	5mil
	Finished copper thickness 35um, before compensation	6mil
	Finished copper thickness 70um, before compensation	9mil
Min. gap between line and line on copper filling layer (before compensation)		5/6mil (partial4/5mil)
Min. gaps between pad to line and pad to pad on copper filling layer (before compensation)		5/5.5mil (partial4/4.5mil)
Min. gap between lines on resin filling layer (before compensation)		5/6mil (partial4/5mil)
Min. gaps between pad to line and pad to pad on resin filling layer (before compensation)		5/5.5mil (partial4/4.5mil)
Min. BGA pad size		10mil (electrical Ni/Au7mil) 12mil (Electrical Ni/Au8mil) normal
Max. dry film tenting hole		6.5mm 4.5mm normal
Min. distance between NPTH edge to external conductor before compensation		6mil
Max. external finished copper thickness		5 oz 4.5mm normal
Min. distance between external conductor and outline		8mil 4.5mm normal
Min. external PTH annual ring single side, before compensation	<35um finished copper thickness	4mil (<2mm); 6mil (2-4.5mm); 10mil (4.6-6.5mm)
	35-70um finished copper thickness	5mil (<2mm); 8mil (2-4.5mm); 14mil (4.6-6.5mm)
	>70um finished copper thickness	7mil (<2mm); 12mil (2-4.5mm); 18mil (4.6-6.5mm)
Drilling	Min. mechanical drill size	0.15mm (≤1.6mm) 0.2mm (≤2.5mm)
	Min. half-hole (pth) size	0.3mm
	Laser blind via size	4mil-6mil (advance6mil)
	Max. buried hole size	0.4mm
	Max. drill hole size	6.3mm
	Max. A/R for through hole	12:1
	Max. A/R for laser blind hole	0.8:1
	Min. gap between hole wall and conductor before compensation	5mil (≤6L), 6mil (7-11L), 10mil (≥12L) (after compensation)
	Min. space between laser holes and conductor	6mil
	Min. tolerance of NPTH	±3mil (limited+0, -6mil or +6mil, -0)
	Slot drill bit diameter	0.40-1.60mm (board thickness≤2.50mm)
	Tolerance of countersink	±0.3mm
	Countersink hole size tolerance	±0.3mm
	Min. distance between PTH hole wall and rigid-flex connect area	0.5mm (after compensation)
	Min. distance between PTH holes	10mil (after compensation) 12mil normal (after compensation)
Solder mask	Min. solder mask bridge (copper ≤1oz)	4mil (Green, Red, Blue), 5mil (Black), 8.0mil (on big copper area)
	Min. solder mask bridge (copper 2-4oz)	6mil,8mil (on big copper area)
	Min. solder mask opening larger than pad single side	4mil (partial 2mil)
	Min. solder mask opening lsrger than NPTH hole signle side	4mil
	Min. width of soldermask cover line (singleside)	4mil (partial1.5mil)
	Max. finished hole size for via filled with Soldermask both side tenting	0.9mm
	Max. solder mask plugging via in pad with both sides opening	0.55mm
	Solder mask color	Green/matte green/Black/Blue/Red/White
	Silk screen color	white/yellow/black
Carbon ink	Carbon thickness	NA
	Min. gap between carbon pads	15mil
	Min. gap between carbon and pads	10mil
	Carbon pad larger than covering pad single side	4mil
Peelable mask	thickness	0.2-0.8mm 0.2-0.5mm normal
Outline	Min. space between the central line of non-copper-exposed V-cut to internal/external circuits (H means board thickness)	H≤40mil: 12mil (20°mean V-cut angle),13mil (30°),14.6mil (45°)
		40
		63
		94.5
	V-cut offset tolerance	±4mil
	V-cut board thickness	0.4-3.2mm ≤0.6mm one side V-cut
	Tolerance of V-cut angle	±5°
	V-cut angle	20°, 30°, 45°
	Gold finger bevelling angle	20°, 30°, 45°, 60°
	Gold finger bevelling tolerance	±5°
	Gold finger bevelling remained thickness tolerance	±5mil
	Min. distance between gold finger and tab	7mm
	Min. gap between the side of gold finger and the outline edge line	8mil
	Min. internal radius	0.3mm
	Depth tolerance of depth-control groove milling	±0.10mm
	Outline tolerance	±0.1mm
	Rout slot tolerance (NPTH)	±0.10mm
	Rout slot tolerance (PTH)	±0.13mm
	Drill slot tolerance (NPTH length/width≥2)	±0.05mm
	Drill slot tolerance (PTH length/width≥2)	±0.075mm
	Drill slot tolerance (NPTH length/width<2)	±0.075mm
	Drill slot tolerance (PTH length/width<2)	±0.1mm
The tolerance between Fiducial mark pad to Fiducial mark pad		≤300mm ±4mil 300-400mm ±5mil 400-500mm ±6mil >500mm ±7mil
IPC Class 3		Yes
Certification	ISO 9001	Yes
Certification	UL number	Yes